Synopsis

This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a technological and a materials science perspective. Edited and authored by key figures from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including the particular challenges and potential. The second part is concerned with the test methods used to assess the quality and reliability of the 3D-integrated devices, while the third and final part deals with thermal management.

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